公开(公告)号：US20160107925A1

公开(公告)日：2016-04-21

申请号：US14972284

申请日：2015-12-17

Applicant: CORNING INCORPORATED

Inventor： Robert Carl Burket ,  Uta-Barbara Goers ,  Samuel Odei Owusu ,  Tammy Lynn Petriwisky

IPC: C03C15/00

CPC classification number: C03C15/00 ,  B23K26/302 ,  B23K26/362 ,  B23K26/364 ,  B23K26/382 ,  B23K26/384 ,  B23K26/402 ,  B23K26/55 ,  B23K2103/54 ,  C03B33/0222 ,  C03C23/00 ,  C03C23/0025 ,  C03C2218/34 ,  H05K1/0306 ,  H05K3/0017 ,  H05K3/002 ,  H05K3/0029 ,  H05K2203/0285

Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.