公开(公告)号：US20210154985A1

公开(公告)日：2021-05-27

申请号：US17091844

申请日：2020-11-06

Applicant: CORNING INCORPORATED

Inventor： Bavani Balakrisnan ,  Brian Joseph Hanlon ,  Joydeep Lahiri ,  Bryan Patrick Livengood ,  Timothy James Orsley

IPC: B32B27/14 ,  B32B5/16

Abstract: According to various examples of the present disclosure, an antimicrobial assembly includes a substrate comprising a matrix material having opposed first and second surfaces with a total thickness of the substrate defined therebetween. The assembly further includes an antimicrobial composition bound to the substrate and heterogeneously distributed about the antimicrobial assembly.