公开(公告)号：US10034410B1

公开(公告)日：2018-07-24

申请号：US15497231

申请日：2017-04-26

Applicant: CHROMA ATE INC.

Inventor： Sheng-Chin Chuang ,  Kuei-Wen Lien ,  Chung-Lin Liu ,  Ming-Ju Chuang ,  Hsiu-Wei Kuo ,  Ming-Hui Wang ,  Chih-Hsien Wang

IPC: H05K7/20 ,  H05K5/02

Abstract: A support apparatus is configured to support electronic components. The support apparatus includes a tray and a plurality of recessed structures. The tray has a cavity therein and at least one intake hole communicated with the cavity. The recessed structures are disposed on the tray and recessed toward the cavity. Each of the recessed structures is configured to accommodate at least a part of a corresponding one of the electronic components and includes a support surface and a plurality of first spacers. The support surface has an exhaust hole communicated with the cavity. The first spacers are disposed on the support surface of a corresponding one of the recessed structures. When a corresponding one of the electronic components is supported on the first spacers, any adjacent two of the first spacers and the corresponding electronic component form a first flow channel.

公开(公告)号：US11324109B2

公开(公告)日：2022-05-03

申请号：US17037269

申请日：2020-09-29

Applicant: CHROMA ATE INC.

Inventor： Chien-Hsing Huang ,  Chung-Lin Liu ,  Chien-Jiu Chou

IPC: H05K1/02 ,  H01R12/57 ,  H05K7/20 ,  H01L23/367 ,  H01L23/467 ,  H01L23/40

Abstract: An electronic load device includes a main board and a load module. The main board has a plurality of first connecting ports. The load module includes a sub board and a heat-dissipating unit. The sub board has a second connecting port and a pin-hole port. The second connecting port is used for detachably connecting one of the plurality of first connecting ports. The pin-hole port is used for connecting a power component. The heat-dissipating unit has a cylindrical body and a plurality of heat-dissipating fins. The cylindrical body is defined with an outer surface and an inner surface opposite to the outer surface. The plurality of heat-dissipating fins is connected with the outer surface. When the power component is connected to the pin-hole port, the power component contacts the inner surface.