Substrate member and method of manufacturing chip
    1.
    发明授权
    Substrate member and method of manufacturing chip 有权
    基片成片及芯片制造方法

    公开(公告)号:US09202787B2

    公开(公告)日:2015-12-01

    申请号:US14036900

    申请日:2013-09-25

    摘要: A substrate member includes a substrate and a plurality of chip regions formed on the substrate across a scribe line. Each of the plurality of chip regions includes a first region that has contact with the scribe line and in which a plurality of first pattern elements are formed, and a second region that is surrounded by the first region and in which a plurality of second pattern elements are formed. A minimum value of a size of the first pattern elements is greater than a minimum value of a size of the second pattern elements and/or a minimum value of an interval between adjacent first pattern elements is greater than a minimum value of an interval between adjacent second pattern elements.

    摘要翻译: 衬底构件包括衬底和跨越划线的在衬底上形成的多个芯片区域。 多个芯片区域中的每一个包括与划线接触并且其中形成有多个第一图案元件的第一区域和由第一区域包围的第二区域,并且多个第二图案元件 形成。 第一图形元素的尺寸的最小值大于第二图案元素的尺寸的最小值和/或相邻第一图案元素之间的间隔的最小值大于相邻的第一图案元素之间的间隔的最小值 第二种图案元素。