公开(公告)号：US20170199226A1

公开(公告)日：2017-07-13

申请号：US15051134

申请日：2016-02-23

Applicant: Broadcom Corporation

Inventor： Timothy SCRANTON ,  Michael BOERS ,  Seunghwan YOON ,  Jesus CASTANEDA

IPC: G01R1/073 ,  G01R31/28 ,  H01P5/12

CPC classification number: G01R1/0735 ,  G01R1/0416 ,  G01R31/2831 ,  H01P5/028 ,  H01P5/12

Abstract: The present disclosure describes a semiconductor wafer testing environment for routing signals used for testing integrated circuits formed onto a semiconductor wafer. The semiconductor wafer testing environment includes a semiconductor wafer tester to control overall operation and/or configuration of the semiconductor wafer testing environment and a semiconductor wafer prober to test the integrated circuits formed onto the semiconductor wafer. The semiconductor wafer prober includes a probe card having a transmission line coupler formed onto a flexible substrate. The transmission line coupler includes multiple transmission line coupling blocks that extend radially from a central point of the flexible substrate in a circular manner.