STRAP ADJUSTMENT APPARATUS OF HEAD-MOUNTED ELECTRONIC DEVICE AND HEAD-MOUNTED ELECTRONIC DEVICE

    公开(公告)号:US20250147325A1

    公开(公告)日:2025-05-08

    申请号:US18837710

    申请日:2023-03-06

    Abstract: A strap adjustment apparatus of a head-mounted electronic device, and a head-mounted electronic device. The strap adjustment apparatus comprises: a strap assembly wherein the strap assembly comprises a strap and a driving gear, the strap comprises a rack portion, and the driving gear is meshed with the rack portion to drive the strap to move by means of the rotation of the driving gear; a knob assembly, wherein the knob assembly comprises a knob and a self-locking mechanism, and the self-locking mechanism cooperates with the knob to limit the rotation direction of the knob; and an elastic reset element, wherein the elastic reset element and the knob are linked to each other so as to switch between a compressed state and a reset state. Therefore, the length of the strap assembly can be adjusted, and the strap adjustment apparatus is matched with a wearer.

    HEAD-MOUNTED VIRTUAL REALITY APPARATUS
    2.
    发明公开

    公开(公告)号:US20240103286A1

    公开(公告)日:2024-03-28

    申请号:US18465694

    申请日:2023-09-12

    CPC classification number: G02B27/0176

    Abstract: The present disclosure provides a head-mounted virtual reality apparatus. The head-mounted virtual reality apparatus includes a first strap and a second strap, a second end of the first strap and a second end of the second strap are both laminated within a housing, a portion of the wire is gathered on a first side of the housing, and the second end of the second strap has an open slot that forms a second chute, the open slot is opposite to the wire and the open slot is in a direction consistent with a direction of movement of the second strap.

    BINDING BAND ASSEMBLY FOR HEADSET AND HEADSET

    公开(公告)号:US20230421957A1

    公开(公告)日:2023-12-28

    申请号:US18343228

    申请日:2023-06-28

    CPC classification number: H04R5/0335

    Abstract: Provided are a binding band assembly for a headset and a headset. The binding band assembly includes: a housing in which a rotatable gear is provided; a first binding band and a second binding band each provided with a rack meshed with the gear to drive the first binding band and the second binding band to move towards or away from each other when the gear rotates; a transmission member provided in the housing and fixedly connected to the gear; and a rotation control member provided on the housing and having a toggle portion, a rolling member being provided between the toggle portion and the transmission member, and the toggle portion being configured to drive, by pushing the rolling member to roll, the transmission member to rotate.

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