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公开(公告)号：US20250142774A1
公开(公告)日：2025-05-01
申请号：US19004084
申请日：2024-12-27
Inventor： Ting TIAN , Bing GAO , Xiaoliang GUO , Tangbo JING , Jian WANG
IPC: H05K7/20
Abstract: Embodiments of the disclosure provide a cooling system including an air cooling part including a first cooler and a first circulation pipeline, the first cooler being configured to cool a coolant inside it with an external liquid, and the first circulation pipeline including a first liquid outlet pipe and a first liquid return pipe; a liquid cooling part including a second cooler and a second circulation pipeline, the second cooler being configured to cool a coolant inside it with an external gas, and the second circulation pipeline including a second liquid outlet pipe and a second liquid return pipe; and a guide assembly connected between the first circulation pipeline and the second circulation pipeline.
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公开(公告)号：US20250142786A1
公开(公告)日：2025-05-01
申请号：US19002522
申请日：2024-12-26
Inventor： Yuanlin REN , Shifeng WANG , Chenglong GUI , Zhichao LV , Ruidong WANG , Ting TIAN , Tangbo JING , Jian WANG , Yulong WANG
IPC: H05K7/20
Abstract: A system and a method for cooling a data center, and a computer room are provided, where the system has a first channel and a second channel and the system includes: a stacking structure located between the first channel and the second channel, the stacking structure includes at least one electronic device and at least one surface cooler stacked with each other, each electronic device has a first air inlet and a first air outlet, each surface cooler has a second air inlet and a second air outlet, the first air outlet and the second air inlet are both oriented towards one side of the first channel, and the first air inlet and the second air outlet are both oriented towards one side of the second channel.
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