公开(公告)号：US20240089650A1

公开(公告)日：2024-03-14

申请号：US18272495

申请日：2022-08-24

申请人： Beijing Honor Device Co., Ltd.

发明人： Chuanguo WANG ,  Yunhai LI ,  Dong WU ,  Chienfeng YEH ,  Yuanwu JIANG

IPC分类号： H04R1/10 ,  H04R9/06 ,  H04R17/00

CPC分类号： H04R1/1075 ,  H04R1/1016 ,  H04R1/1041 ,  H04R9/06 ,  H04R17/00 ,  H04R2400/11

摘要： Disclosed are a speaker module and an earphone. The speaker module includes a first speaker unit, a bracket, and a second speaker unit. The first speaker unit includes a basin frame and a wiring terminal. The wiring terminal is disposed on the basin frame. The bracket includes an electrically conductive portion. The second speaker unit is fastened to the basin frame by using the bracket. An electrode of the second speaker unit is electrically connected to the wiring terminal by using the electrically conductive portion.

公开(公告)号：US20240259720A1

公开(公告)日：2024-08-01

申请号：US18019125

申请日：2022-08-17

申请人： Beijing Honor Device Co., Ltd.

发明人： Chienfeng YEH

IPC分类号： H04R1/10

CPC分类号： H04R1/1016 ,  H04R1/1083 ,  H04R2460/11

摘要： Embodiment of this application provides an earphone. The earphone includes at least a housing and at least one eartip. The housing includes a housing body and a sound outlet connected to the housing body. At least one first vent hole is disposed on the housing. When the eartip cooperates with the sound outlet, the at least one first vent hole is completely exposed or at least partially shielded, which can effectively alleviate an occlusion effect while avoiding impact on sound quality and a noise reduction effect of the earphone.