公开(公告)号：US12302535B2

公开(公告)日：2025-05-13

申请号：US18772829

申请日：2024-07-15

Applicant: Beijing Bytedance Network Technology Co., Ltd.

Inventor： Jian Wang ,  Bin Lin ,  Zhichao Lv ,  Shifeng Wang ,  Yulong Wang ,  Ruidong Wang

IPC: H05K7/20

Abstract: The embodiments of the present disclosure provide a modular cooling device and a cooling system. The device includes: an air cooling box adapted to sealingly receive a predetermined number of electronic devices to be cooled; and a heat exchange unit coupled to the air cooling box and comprising: a housing sealingly enclosing a heat exchange chamber, the heat exchange chamber sealingly connecting with an interior of the air cooling box to allow air to circulate between the interior of the air cooling box and the heat exchange chamber as an effect of fans of the electronic devices; and a heat exchanger arranged in the heat exchange chamber and comprising paths for enabling circulating air to circulate; and a cooling interface at least partly arranged on the housing and adapted to allow a cooling medium to circulate between an external cold source and an interior of the heat exchanger.