公开(公告)号：US09693461B2

公开(公告)日：2017-06-27

申请号：US14684256

申请日：2015-04-10

Applicant: BROADCOM CORPORATION

Inventor： Sam Ziqun Zhao ,  Edward Law ,  Sampath Komarapalayam Karikalan ,  Neal Andrew Kistler ,  Rezaur Rahman Khan ,  Pieter Vorenkamp

IPC: H01F5/00 ,  H05K1/18 ,  H01F17/00 ,  H01F41/04 ,  H01F27/28 ,  H01F17/04 ,  H01F38/14

CPC classification number: H05K1/181 ,  H01F17/0013 ,  H01F17/045 ,  H01F38/14 ,  H01F41/046 ,  H01F2017/0053 ,  H01F2017/0066 ,  H01F2027/2809 ,  H01L2224/16225

Abstract: A 3-dimensional (3-D) magnetic core device includes a substrate, a first magnetic shell formed on the substrate, and a first group of conductive traces embedded in a first insulator layer formed on the first magnetic shell. A magnetic core plane is formed on the first insulator layer, and a second group of conductive traces are embedded in a second insulator layer formed on the magnetic core plane. A second magnetic shell is formed on the second insulator layer, and the first and second group of conductive traces are conductively coupled by using conductive vias.