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公开(公告)号：US10344963B1
公开(公告)日：2019-07-09
申请号：US15982063
申请日：2018-05-17
Applicant: BOSE CORPORATION
Inventor： Darius Mobed , Joel H. Miller , Joseph Titlow , Jesse Flack , Lee Zamir
Abstract: Aspects of the present disclosure provide a headphone assembly having a customizable ear cups. Specifically, a user may customize an outer surface of an ear cup assembly by selecting one or more of color to be illuminated on the outer surface and an insert. The insert further diffuses the illuminate light. A trim ring that secures the insert is configured to overlay the lightpipe and a portion of an ear cup subassembly regardless of the presence of the insert.
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