Abstract:
A method for surface treatment is disclosed which relates to the technical field of producing thin-film devices by printing and solves the problem that the treatment of a substrate surface in the prior art can hardly meet the requirement for printing. The method for surface treatment includes a step of subjecting a surface of a base plate having at least two kinds of substrate patterns formed thereon to a surface treatment for forming a self-assembled monomolecular layer for at least once and a surface treatment by ultraviolet-ozone cleaning, so as to make the difference between the surface energies of the substrate patterns larger or smaller. The method for surface treatment of the invention is suitable for the surface treatment of the substrate surface during producing thin-film devices by printing.
Abstract:
An organic thin film transistor and a manufacturing method thereof are provided. The organic thin film transistor comprises: a substrate; a gate electrode layer (21) and a source/drain electrode layer (24), formed on the substrate; an organic semiconductor layer (25), formed between source and drain electrodes (24) of the source/drain electrode layer; and an organic insulating layer (23), formed between the gate electrode layer (21) and the organic semiconductor layer (25) and made from an organic polymer material.
Abstract:
An organic thin film transistor, a preparing method thereof, and a preparation equipment. The preparation equipment of an organic thin film transistor comprises: forming a gate electrode, a gate insulating layer, an organic semiconductor layer, and source-drain electrodes on a substrate; the step of forming the organic semiconductor layer comprises: blade-coating a solution in which an organic semiconductor material used to forming the organic semiconductor layer is dissolved to form the organic semiconductor layer. The preparing method can avoid the difference between the edge and the center of the substrate caused by the impact of centripetal force when a spin-coating method is applied, so that the yield of the organic thin film transistor devices is improved.
Abstract:
An organic thin film transistor and a manufacturing method thereof are provided. The organic thin film transistor comprises: a substrate; a gate electrode layer (21) and a source/drain electrode layer (24), formed on the substrate; an organic semiconductor layer (25), formed between source and drain electrodes (24) of the source/drain electrode layer; and an organic insulating layer (23), formed between the gate electrode layer (21) and the organic semiconductor layer (25) and made from an organic polymer material.
Abstract:
An organic thin film transistor, a preparing method thereof, and a preparation equipment. The preparation equipment of an organic thin film transistor comprises: forming a gate electrode, a gate insulating layer, an organic semiconductor layer, and source-drain electrodes on a substrate; the step of forming the organic semiconductor layer comprises: blade-coating a solution in which an organic semiconductor material used to forming the organic semiconductor layer is dissolved to form the organic semiconductor layer. The preparing method can avoid the difference between the edge and the center of the substrate caused by the impact of centripetal force when a spin-coating method is applied, so that the yield of the organic thin film transistor devices is improved.