公开(公告)号：US20230343895A1

公开(公告)日：2023-10-26

申请号：US18019823

申请日：2022-02-10

Applicant: BOE MLED Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Pengjun CAO ,  Pei LI ,  Jinpeng LI ,  Jian LI ,  Teng ZHANG ,  Kangle CHANG ,  Zhaohui LI ,  Zhifu YANG

IPC: H01L33/24 ,  H01L27/15 ,  H01L33/46 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62

CPC classification number: H01L33/24 ,  H01L27/156 ,  H01L33/46 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62

Abstract: A light emitting substrate, comprising a base substrate, a retaining wall disposed on the base substrate, and a plurality of light emitting diodes. The retaining wall defines a plurality of partitions on the base substrate, and at least one light emitting diode is provided in at least one partition.

公开(公告)号：US20240282900A1

公开(公告)日：2024-08-22

申请号：US18649385

申请日：2024-04-29

Applicant: BOE MLED Technology Co., Ltd. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Shubai ZHANG ,  Lingyun SHI ,  Wei ZHANG ,  Longtao HUANG ,  Zhaohui LI ,  Zhifu YANG ,  Hao CHENG

IPC: H01L33/62 ,  G06T7/00 ,  H01L33/58

CPC classification number: H01L33/62 ,  G06T7/0004 ,  H01L33/58 ,  G06T2207/30121 ,  G06T2207/30152 ,  H01L2933/0066

Abstract: A circuit substrate includes a base substrate, traces, a protective layer, and an electronic device. The traces are provided on the base substrate. The protective layer is provided on the traces, and has openings each exposing a portion of a trace, the portion serving as a conductive pattern. The electronic device includes a chip and multiple bumps provided on the chip. The conductive pattern is connected to at least one of the bumps on the chip. The conductive pattern includes a first portion and a second portion connected to each other. An orthographic projection of the chip on the base substrate covers an orthographic projection of the first portion on the base substrate, and is non-overlapping with an orthographic projection of the second portion on the base substrate. The total area of conductive patterns connected to the chip is less than an area of the chip.

公开(公告)号：US20250079423A1

公开(公告)日：2025-03-06

申请号：US18579851

申请日：2022-05-27

Applicant: BOE MLED Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Jinpeng LI ,  Zhifu YANG ,  Ming ZHAI ,  Enkai DONG ,  Ling WANG ,  Shuangjian WANG ,  Jiacheng QI ,  Liang SUN ,  Qiqi ZHOU ,  Yutian CHU ,  Le WANG

IPC: H01L25/16 ,  H01L25/075 ,  H01L33/54 ,  H01L33/62

Abstract: Provided are a display baseplate, a mould assembly, a spliced display module, and a display apparatus. The display baseplate includes a backplate light emitters and an encapsulation layer. The backplate includes a first main surface and a second main surface that are opposite to each other, and side surfaces connected to the first main surface and the second main surface light emitters are located on the first main surface, the encapsulation layer is at least partially located on the first main surface and covers the plurality of light emitters. The spliced display module includes a splicing units, the splicing units each include a splicing frame and a display baseplate, the display baseplate is fixed on the splicing frame with the light emitters away from the splicing frame; and the splicing frames of adjacent splicing units are spliced together. The display apparatus includes a display baseplate or a spliced display module.

公开(公告)号：US20240145645A1

公开(公告)日：2024-05-02

申请号：US18573590

申请日：2022-09-26

Applicant: BOE MLED Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Jinpeng LI ,  Ming ZHAI ,  Zhifu YANG ,  Shubai ZHANG ,  Teng ZHANG ,  Jian LI ,  Heling ZHU ,  Pei QIN

IPC: H01L33/54 ,  H01L25/075 ,  H01L33/56

CPC classification number: H01L33/54 ,  H01L25/0753 ,  H01L33/56

Abstract: The present disclosure provides an encapsulating structure, a display substrate and a manufacturing method therefor, and a display apparatus. The encapsulating structure is used for encapsulating components, and includes: a first encapsulating layer configured to cover the components; and a second encapsulating layer stacked with the first encapsulating layer; the second encapsulating layer is located on the side of the first encapsulating layer away from the components, a surface of the second encapsulating layer facing the first encapsulating layer is in contact with a surface of the first encapsulating layer facing the second encapsulating layer, and a surface of the second encapsulating layer away from the first encapsulating layer is substantially parallel to a plane where the encapsulating structure is located.