专利检索 ap:("BLOOM ENERGY CORPORATION") AND inv:"Adam BYRD" 第 1 页

1.

发明公开
BINDER JET PRINTING OF METALLIC INTERCONNECT FOR SOLID OXIDE ELECTROCHEMICAL CELL STACK 审中-公开

公开(公告)号：US20240139810A1

公开(公告)日：2024-05-02

申请号：US18497480

申请日：2023-10-30

申请人： BLOOM ENERGY CORPORATION

发明人： Adam BYRD

IPC分类号： B22F10/14 , B22F1/00 , B22F3/10 , B22F5/10 , B33Y10/00 , B33Y80/00 , H01M8/1246 , H01M8/2404

CPC分类号： B22F10/14 , B22F1/09 , B22F3/1021 , B22F5/10 , B33Y10/00 , B33Y80/00 , H01M8/1246 , H01M8/2404 , B22F2301/20 , B22F2301/35

摘要： A method includes binder jet printing a metal alloy powder or a metal powder mixture to form a green interconnect, debinding the green interconnect, and sintering the green interconnect to form a metal alloy interconnect for an electrochemical stack.

2.

发明公开
INERT ATMOSPHERE SINTERING OF ELECTROCHEMICAL CELL STACK INTERCONNECTS 审中-公开

公开(公告)号：US20240347739A1

公开(公告)日：2024-10-17

申请号：US18624584

申请日：2024-04-02

申请人： BLOOM ENERGY CORPORATION

发明人： Zigui LU , Guoliang XIAO , Tad ARMSTRONG , Keji PAN , Adam BYRD

IPC分类号： H01M8/0215 , C04B24/38 , C04B35/64 , C04B41/50 , H01M8/12 , H01M8/2404

CPC分类号： H01M8/0215 , C04B24/383 , C04B35/64 , C04B41/5046 , H01M8/12 , H01M8/2404 , C04B2235/3262 , C04B2235/3272 , C04B2235/3275 , C04B2235/3279 , C04B2235/3281 , C04B2235/6585 , H01M2008/1293

摘要： A method of forming a protective layer on an interconnect for an electrochemical cell stack includes coating at least one side of the interconnect with a metal oxide powder to form a protective layer, sintering the coated interconnect in an inert atmosphere to at least partially reduce the protective layer, and oxidizing the sintered interconnect in an oxidizing atmosphere to oxidize and densify the protective layer.

3.

发明公开
METHOD OF FORMING AN INTERCONNECT COATING FOR AN ELECTROCHEMICAL DEVICE STACK USING LASER SINTERING 审中-公开

公开(公告)号：US20240093376A1

公开(公告)日：2024-03-21

申请号：US18470064

申请日：2023-09-19

申请人： BLOOM ENERGY CORPORATION

发明人： Adam BYRD , Zigui LU , Guoliang XIAO , Tad ARMSTRONG , Harald HERCHEN , Travis SCHMAUSS , Keji PAN

IPC分类号： C23C24/08 , C25B9/65 , H01M8/0206 , H01M8/0217 , H01M8/0226 , H01M8/0228

CPC分类号： C23C24/082 , C25B9/65 , H01M8/0206 , H01M8/0217 , H01M8/0226 , H01M8/0228

摘要： A method of forming a protective coating on an interconnect for an electrochemical device stack includes providing a powder on the interconnect and laser sintering the powder.

4.

发明公开
METHOD OF FORMING AN INTERCONNECT FOR AN ELECTROCHEMICAL DEVICE STACK USING SPARK PLASMA SINTERING 审中-公开

公开(公告)号：US20240082916A1

公开(公告)日：2024-03-14

申请号：US18458298

申请日：2023-08-30

申请人： BLOOM ENERGY CORPORATION

发明人： Adam BYRD , Adil ASHARY

IPC分类号： B22F7/06 , B22F3/105 , H01M8/021 , H01M8/0217 , H01M8/0228 , H01M8/1246

CPC分类号： B22F7/064 , B22F3/105 , H01M8/021 , H01M8/0217 , H01M8/0228 , H01M8/1246 , H01M2008/1293

摘要： A method of forming an interconnect for an electrochemical device stack includes loading a die with an interconnect material comprising an interconnect body powder comprising chromium and iron, and spark plasma sintering (SPS) the interconnect material to form a body of the interconnect.