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公开(公告)号:US3900864A
公开(公告)日:1975-08-19
申请号:US40459973
申请日:1973-10-09
Applicant: BELL TELEPHONE LABOR INC
Inventor: DAPKUS PAUL DANIEL , DIXON RICHARD WAYNE , WEICK WALTER WERNER
Abstract: The specification describes a process for defining the activedisplay regions in a monolithic electroluminescent display device. According to the process, the emitting regions of a semiconductor chip are electrically and optically isolated from the rest of the chip by laser machining. The chip remains intact with grooves extending below the junction to form active junction ''''islands.'''' The technique is advantageous with indirect band gap semiconductors, such as GaP, that can be viewed through the unmachined surface. In a preferred form the grooves are formed in a grid configuration. This structure has advantages in terms of cost and simplicity of manufacture.
Abstract translation: 本说明书描述了在单片电致发光显示装置中定义有源显示区域的过程。 根据该过程,半导体芯片的发光区域通过激光加工与芯片的其余部分电隔离和光学隔离。 芯片保持完整,凹槽在结点下方延伸,形成主动结“岛”。 该技术对于可以通过未加工表面观察的间接带隙半导体(例如GaP)是有利的。 在优选的形式中,凹槽以格栅形式形成。 该结构在成本和制造简单性方面具有优点。
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公开(公告)号:US3877052A
公开(公告)日:1975-04-08
申请号:US42778573
申请日:1973-12-26
Applicant: BELL TELEPHONE LABOR INC
Inventor: DIXON RICHARD WAYNE , JOYCE WILLIAM BAXTER , RODE DANIEL LEON
CPC classification number: H01L33/46 , G02B6/4204 , H01L33/00 , H01L33/385
Abstract: A semiconductor light-emitting diode (LED), which is substantially transparent to its own generated radiation, is coated with a reflecting layer having an exit aperture for transmission of optical radiation, for example, to an optical fiber. The reflecting layer includes a layer of dielectric in contact with the semiconductor, the dielectric layer itself being coated with an optically reflecting metal layer. The dielectric layer is made sufficiently thick to prevent the evanescent waves (of the totally internally reflected light in the semiconductor) from contacting the metal, thereby affording very close to 100 percent optical reflection of the optical rays in the semiconductor which are incident on the dielectric at greater than the critical angle. In addition, a significant portion of the semiconductor-dielectric interface is rough, thereby scattering (randomizing) the totally internally reflected rays in the semiconductor, which rays otherwise would have no chance of being accepted into the optical fiber. Thus, the overall coupling efficiency of optical radiation from the diode to the optical fiber is enhanced.
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公开(公告)号:US3694902A
公开(公告)日:1972-10-03
申请号:US3694902D
申请日:1970-08-31
Applicant: BELL TELEPHONE LABOR INC
Inventor: APGAR WALDO DITMAR , ASARO LUCIAN ARTHUR D , DIXON RICHARD WAYNE , DUFFT WILLIAM HENRY , ELDER HARRY EUGENE , FRALEY PHILLIP EDWARD
CPC classification number: H05B33/06 , G09F13/22 , G09F2013/222 , H01L23/49534 , H01L23/49562 , H01L33/54 , H01L33/62 , H01L2224/48472 , H05B33/00 , H05B33/04
Abstract: A method of fabricating electroluminescent display apparatus by forming a lead-frame from a laminate comprising two metal layers and an intervening insulating layer, is disclosed. The lead-frame comprises an array of laminate strip members, the tip of each of which may be cut back to expose the inside face of one metal layer. A light emitting semiconductor device then is mounted and electrically connected either to the inner or end face of the projecting metal layer. The other contact of the device is connected, typically by a wire lead or a metal beam lead, to the other metal layer of the laminate strip. Each semiconductor device and adjoining portion of the conductive mounting is encapsulated in a molded transparent plastic member, and supporting portions of the lead-frame then are severed to make each encapsulated diode available for individual assembly. Portions of the outer surface of the molded transparent member may be faceted and metal coated for improved light reflection and visual impact.
Abstract translation: 公开了一种通过从包括两个金属层和中间绝缘层的层压体形成引线框来制造电致发光显示装置的方法。 引线框架包括层叠条状构件的阵列,其每一个的尖端可以被切割以暴露一个金属层的内表面。 然后将发光半导体器件安装并电连接到突出金属层的内表面或端面。 该装置的另一个接触点通常由导线或金属引线引导到层压条的另一个金属层。 每个半导体器件和导电安装件的相邻部分被封装在模制的透明塑料构件中,然后将引线框架的支撑部分切断,以使每个封装二极管可用于单独组装。 模制的透明构件的外表面的一些部分可以是刻面的并且被金属涂覆以改善光反射和视觉冲击。
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