Laser machining method and apparatus
    1.
    发明授权
    Laser machining method and apparatus 失效
    激光加工方法和装置

    公开(公告)号:US3622742A

    公开(公告)日:1971-11-23

    申请号:US3622742D

    申请日:1970-05-27

    CPC classification number: B23K26/0823

    Abstract: Thin film integrated circuits are formed by coating insulative substrates with conductive film and mounting them on the periphery of a rotating drum. As the drum rotates, a switched laser machines the circuit pattern by vaporizing parts of the metal film of successive substrates. Light from another laser is directed through a mask on the drum circumference and controls modulation of the machining laser.

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