SUPERCONDUCTING QUANTUM CHIP
    1.
    发明公开

    公开(公告)号:US20230195988A1

    公开(公告)日:2023-06-22

    申请号:US18108585

    申请日:2023-02-11

    Inventor: Kehui YU Lijing Jin

    CPC classification number: G06F30/39 G06N10/00

    Abstract: A method is provided. The method includes: obtaining a parameter value of a determined dimension parameter, an initial parameter value of a dimension parameter to be optimized, and a target capacitance value of an interdigital capacitor; partitioning a geometric structure of the interdigital capacitor to obtain a plurality of sections of the interdigital capacitor, where the plurality of sections are in a one-to-one correspondence with a plurality of coplanar multiple-transmission line models; obtaining a capacitance value expression of the interdigital capacitor based on the plurality of coplanar multiple-transmission line models; determining, based on the parameter value of the determined dimension parameter, the target capacitance value, and the capacitance value expression of the interdigital capacitor, a loss function including the dimension parameter to be optimized; and optimizing, based on the initial parameter value by minimizing the loss function, the parameter value of the dimension parameter to be optimized.

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