公开(公告)号：US20230168723A1

公开(公告)日：2023-06-01

申请号：US17893415

申请日：2022-08-23

Applicant: BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD.

Inventor： Dongxin LI ,  Xin JIN

IPC: G06F1/20

CPC classification number: G06F1/20

Abstract: A thermal relief implementing method and apparatus, an electronic device and a storage medium, which relate to the field of artificial intelligence, such as artificial intelligence chips, are disclosed. The method may include: determining a number of reflow holes for any pin, and determining a number of connection layers for thermal relief connection according to the number of the reflow holes; adjusting at least one parameter of the number of the reflow holes, the number of the connection layers, or widths of connection points of at least one layer until predetermined heat dissipation constraint and impedance design requirement are met; and taking current parameter values as required thermal-relief design parameters.