LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20210391516A1

    公开(公告)日:2021-12-16

    申请号:US16953337

    申请日:2020-11-20

    IPC分类号: H01L33/62 H01L33/38 H01L33/00

    摘要: A light emitting device including a substrate, a first pad, a second pad, a light emitting diode, a first connection structure, a second connection structure, and a patterned adhesive layer and a method for manufacturing the same are provided. The first pad and the second pad are located on the substrate. The light emitting diode includes a first semiconductor layer, a second semiconductor layer overlapping the first semiconductor layer, a first electrode and a second electrode. The first electrode and the second electrode are respectively connected to the first semiconductor layer and the second semiconductor layer. The first connection structure electrically connects the first electrode to the first pad. The second connection structure electrically connects the second electrode to the second pad. The patterned adhesive layer is located between the substrate and the light emitting diode and does not contact the first connection structure and the second connection structure.

    LIGHT EMITTING DIODE PANEL AND TILING DISPLAY APPARATUS

    公开(公告)号:US20200381586A1

    公开(公告)日:2020-12-03

    申请号:US16686211

    申请日:2019-11-18

    摘要: An LED panel including a substrate, multiple first pixels, multiple second pixels, multiple first protrusion structures and second protrusion structures is provided. The first pixels and second pixels each disposed in a display area of the substrate has at least one light emitting element. The second pixels are positioned on at least one display edge of the display area and positioned between the first pixels and a substrate edge. Each first protrusion structure is positioned on the periphery of the at least one light emitting element of one corresponding first pixel. Each second protrusion structure is positioned on the periphery of the at least one light emitting element of one corresponding second pixel. The orthogonal projection contour of each first protrusion structure on the substrate is different from that of each second protrusion structure on the substrate. A tiling display apparatus adopting the light emitting diode panel is also provided.

    Pixel Structure and display panel

    公开(公告)号:US10082707B2

    公开(公告)日:2018-09-25

    申请号:US15058155

    申请日:2016-03-02

    摘要: A pixel structure including a scan line, a data line, an active device, a first protruding structure, a second protruding structure, a first electrode and a second electrode is provided. The first protruding structure has a first top surface, a first bottom surface and first side surfaces located on both sides of the first top surface and the first bottom surface. A first acute angle θ1 is formed between the first top surface and the first side surfaces. The second protruding structure has a second top surface, a second bottom surface and second side surfaces located on both sides of the second top surface and the second bottom surface. A second acute angle θ2 is formed between the second top surface and the second side surfaces. The first electrode is disposed on the first top surface, and the second electrode is disposed on the second top surface.

    Pixel array substrate including flux structure layer for improving LED contact and method of manufacturing thereof

    公开(公告)号:US11322670B2

    公开(公告)日:2022-05-03

    申请号:US17035700

    申请日:2020-09-29

    IPC分类号: H01L33/62 H01L25/075

    摘要: A pixel array substrate has a plurality of sub-pixel regions, wherein a pixel structure of an individual sub-pixel region includes a first signal line, a second signal line, a first contact pad, a second contact pad, a light-emitting diode, a first conductive structure, and a flux structure layer. The first contact pad and the second contact pad are respectively electrically connected with the first signal line and the second signal line. The light-emitting diode is disposed on the first contact pad. A portion of the first conductive structure is disposed between the first contact pad and a first electrode of the light-emitting diode. The flux structure layer partially surrounds the first conductive structure and the light-emitting diode. A top portion of the flux structure layer is higher than a top surface of the first electrode and is lower than a bottom surface of a light-emitting layer of the light-emitting diode.

    Pixel array substrate and driving method thereof

    公开(公告)号:US10978496B2

    公开(公告)日:2021-04-13

    申请号:US16407204

    申请日:2019-05-09

    摘要: A pixel array substrate and a driving method of a pixel array substrate are provided. The pixel array substrate includes a substrate, at least one pixel structure located on the substrate and a liquid crystal layer. The at least one pixel structure includes a micro light emitting diode (μLED), a supporting wall, a first bottom electrode located between the supporting wall and the μLED, and a first top electrode disposed on the supporting wall and separated from the first bottom electrode. The μLED includes a first electrode, a first semiconductor layer electrically connected to the first electrode, a second semiconductor layer, a light-emitting layer located between the first semiconductor layer and the second semiconductor layer, and a second electrode electrically connected to the second semiconductor layer. The liquid crystal layer is disposed on the first bottom electrode and located between the supporting wall and the μLED.

    PIXEL ARRAY SUBSTRATE INCLUDING FLUX STRUCTURE LAYER FOR IMPROVING LED CONTACT AND METHOD OF MANUFACTURING THEREOF

    公开(公告)号:US20210013389A1

    公开(公告)日:2021-01-14

    申请号:US17035700

    申请日:2020-09-29

    IPC分类号: H01L33/62 H01L25/075

    摘要: A pixel array substrate has a plurality of sub-pixel regions, wherein a pixel structure of an individual sub-pixel region includes a first signal line, a second signal line, a first contact pad, a second contact pad, a light-emitting diode, a first conductive structure, and a flux structure layer. The first contact pad and the second contact pad are respectively electrically connected with the first signal line and the second signal line. The light-emitting diode is disposed on the first contact pad. A portion of the first conductive structure is disposed between the first contact pad and a first electrode of the light-emitting diode. The flux structure layer partially surrounds the first conductive structure and the light-emitting diode. A top portion of the flux structure layer is higher than a top surface of the first electrode and is lower than a bottom surface of a light-emitting layer of the light-emitting diode.

    DISPLAY PANEL
    7.
    发明申请

    公开(公告)号:US20210384379A1

    公开(公告)日:2021-12-09

    申请号:US17338664

    申请日:2021-06-04

    摘要: A display panel including a substrate, a light-emitting device, a light-shielding layer, and a light-guide pillar is provided. The light-emitting device is disposed on the substrate. The light-shielding layer is disposed on the substrate and has a sidewall surrounding an opening. The light-guide pillar is disposed between the substrate and the light-emitting device and located in the opening. A gap exists between the light-guide pillar and the sidewall of the light-shielding layer.

    Light emitting diode panel and tiling display apparatus

    公开(公告)号:US11195970B2

    公开(公告)日:2021-12-07

    申请号:US16686211

    申请日:2019-11-18

    摘要: An LED panel including a substrate, multiple first pixels, multiple second pixels, multiple first protrusion structures and second protrusion structures is provided. The first pixels and second pixels each disposed in a display area of the substrate has at least one light emitting element. The second pixels are positioned on at least one display edge of the display area and positioned between the first pixels and a substrate edge. Each first protrusion structure is positioned on the periphery of the at least one light emitting element of one corresponding first pixel. Each second protrusion structure is positioned on the periphery of the at least one light emitting element of one corresponding second pixel. The orthogonal projection contour of each first protrusion structure on the substrate is different from that of each second protrusion structure on the substrate. A tiling display apparatus adopting the light emitting diode panel is also provided.

    Pixel array substrate including flux structure layer for improving LED contact and method of manufacturing thereof

    公开(公告)号:US10811580B2

    公开(公告)日:2020-10-20

    申请号:US16183719

    申请日:2018-11-07

    IPC分类号: H01L33/62 H01L25/075

    摘要: A pixel array substrate has a plurality of sub-pixel regions, wherein a pixel structure of an individual sub-pixel region includes a first signal line, a second signal line, a first contact pad, a second contact pad, a light-emitting diode, a first conductive structure, and a flux structure layer. The first contact pad and the second contact pad are respectively electrically connected with the first signal line and the second signal line. The light-emitting diode is disposed on the first contact pad. A portion of the first conductive structure is disposed between the first contact pad and a first electrode of the light-emitting diode. The flux structure layer partially surrounds the first conductive structure and the light-emitting diode. A top portion of the flux structure layer is higher than a top surface of the first electrode and is lower than a bottom surface of a light-emitting layer of the light-emitting diode.

    PIXEL ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20190181317A1

    公开(公告)日:2019-06-13

    申请号:US16183719

    申请日:2018-11-07

    IPC分类号: H01L33/62 H01L25/075

    摘要: A pixel array substrate has a plurality of sub-pixel regions, wherein a pixel structure of an individual sub-pixel region includes a first signal line, a second signal line, a first contact pad, a second contact pad, a light-emitting diode, a first conductive structure, and a flux structure layer. The first contact pad and the second contact pad are respectively electrically connected with the first signal line and the second signal line. The light-emitting diode is disposed on the first contact pad. A portion of the first conductive structure is disposed between the first contact pad and a first electrode of the light-emitting diode. The flux structure layer partially surrounds the first conductive structure and the light-emitting diode. A top portion of the flux structure layer is higher than a top surface of the first electrode and is lower than a bottom surface of a light-emitting layer of the light-emitting diode.