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公开(公告)号:US20230215835A1
公开(公告)日:2023-07-06
申请号:US17646586
申请日:2021-12-30
申请人: Atieva, Inc.
CPC分类号: H01L24/78 , H01L22/14 , H01L24/85 , H01L2224/789 , H01L2224/78611 , H01L2224/7855 , H01L2224/859 , H01L2224/851
摘要: In a general aspect, a wire bonding apparatus can include a supply of bond wire, a wire bonding head, and an electrical continuity tester. The wire bonding head can including a wire cutter. The wire cutter can be electrically conductive. The electrical continuity tester can be coupled between the supply of bond wire and the wire cutter.
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公开(公告)号:US12100864B2
公开(公告)日:2024-09-24
申请号:US17651474
申请日:2022-02-17
申请人: Atieva, Inc.
IPC分类号: H01M50/547 , H01M50/505 , H01M50/509 , H01M50/514
CPC分类号: H01M50/547 , H01M50/505 , H01M50/509 , H01M50/514
摘要: A battery module comprises: electrochemical cells arranged in rows with terminals in a coplanar arrangement, wherein the electrochemical cells include a first cell and a second cell; a busbar including coplanar interleaved fingers, wherein the first and second cells are positioned on opposite sides of a first coplanar interleaved finger of the coplanar interleaved fingers; and a first bond wire having: (i) a first wire bond at a first terminal of the first cell, (ii) a second wire bond at a first terminal of the second cell, and (iii) a first intermediate wire bond at the first coplanar interleaved finger between the first and second wire bonds.
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公开(公告)号:US20230261341A1
公开(公告)日:2023-08-17
申请号:US17651474
申请日:2022-02-17
申请人: Atieva, Inc.
IPC分类号: H01M50/547 , H01M50/505 , H01M50/509 , H01M50/514
CPC分类号: H01M50/547 , H01M50/505 , H01M50/509 , H01M50/514
摘要: A battery module comprises: electrochemical cells arranged in rows with terminals in a coplanar arrangement, wherein the electrochemical cells include a first cell and a second cell; a busbar including coplanar interleaved fingers, wherein the first and second cells are positioned on opposite sides of a first coplanar interleaved finger of the coplanar interleaved fingers; and a first bond wire having: (i) a first wire bond at a first terminal of the first cell, (ii) a second wire bond at a first terminal of the second cell, and (iii) a first intermediate wire bond at the first coplanar interleaved finger between the first and second wire bonds.
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