System-in-package architecture with wireless bus interconnect

    公开(公告)号:US11366779B2

    公开(公告)日:2022-06-21

    申请号:US16685090

    申请日:2019-11-15

    IPC分类号: G06F13/40 H04L12/40

    摘要: A chip-carrier package includes a data processing system having one or more slave dies, a master die and a system bus. Each slave die includes a slave device and a slave-side wireless bus interface (WBI) coupled to the slave device. The master die includes a master device, one or more bus-side WBIs coupled to the master device. Each bus-side WBI is configured to be wirelessly coupled to at least one slave-side WBI of the one or more slave dies and a system bus. The system bus includes the one or more bus-side WBIs and the slave-side WBIs of the one or more slave-side dies. The system bus is configured to exchange information between the master device and the slave devices of the one or more slave dies.

    System-In-Package Architecture with Wireless Bus Interconnect

    公开(公告)号:US20210149834A1

    公开(公告)日:2021-05-20

    申请号:US16685090

    申请日:2019-11-15

    IPC分类号: G06F13/40 H04L12/40

    摘要: A chip-carrier package includes a data processing system having one or more slave dies, a master die and a system bus. Each slave die includes a slave device and a slave-side wireless bus interface (WBI) coupled to the slave device. The master die includes a master device, one or more bus-side WBIs coupled to the master device. Each bus-side WBI is configured to be wirelessly coupled to at least one slave-side WBI of the one or more slave dies and a system bus. The system bus includes the one or more bus-side WBIs and the slave-side WBIs of the one or more slave-side dies. The system bus is configured to exchange information between the master device and the slave devices of the one or more slave dies.