MULTI-COMPONENT SYSTEMS FOR PREPARING FOAMED PRODUCTS

    公开(公告)号:US20220033606A1

    公开(公告)日:2022-02-03

    申请号:US17299352

    申请日:2019-12-02

    申请人: Arkema France

    IPC分类号: C08J9/14 C08L81/02 C08J9/00

    摘要: Foamed products are produced using multi-component systems which are advantageously free of isocyanate. The components of the systems are combined, with the resulting mixture then undergoing curing and foaming to provide a foamed product, wherein the characteristics of the foamed product may be varied by selecting particular reactants to be present in the multi-component system. The systems employ at least one (meth)acrylate compound having two or more (meth)acrylate functional groups per molecule, at least one thiol compound having two or more thiol functional groups per molecule, at least one free radical initiator, at least one blowing agent, at least one surfactant, and optionally at least one promoter for the free radical initiator.

    CURABLE HEAT-SEAL ADHESIVES FOR BONDING POLYMERS

    公开(公告)号:US20220017674A1

    公开(公告)日:2022-01-20

    申请号:US17299364

    申请日:2019-12-02

    申请人: Arkema France

    摘要: Curable compositions include a urethane (meth)acrylate oligomer having a number—average molecular weight of at least 6000 g/mol; at least one mono(meth)acrylate monomer; a multifunctional crosslinking monomer chosen from acrylate monomers, methacrylate monomers, or combinations thereof; and an ethylene-vinyl acetate grafted terpolymer. The mono(meth)acrylate monomers may include a first mono(meth)acrylate with Tg between 50° C. and 175° C. and a second mono(meth)acrylate with Tg between −50° C. and 30° C. The curable compositions may be applied onto a surface of a substrate then cured to form a low-tack adhesive layer on the surface. The curable compositions may be cured by exposure to visible radiation, UV radiation, LED radiation, laser radiation, electron-beam radiation, peroxide, accelerator, or heat. Methods for bonding substrates include contacting a second substrate to a tow-tack adhesive layer on a first substrate, then heating the low-tack adhesive layer to bond the substrates and form a laminate.