Measuring height difference in patterns on semiconductor wafers

    公开(公告)号:US10748272B2

    公开(公告)日:2020-08-18

    申请号:US15982918

    申请日:2018-05-17

    IPC分类号: G06K9/00 G06T7/00 G06T7/60

    摘要: An improved technique for determining height difference in patterns provided on semiconductor wafers uses real measurements (e.g., measurements from SEM images) and a height difference determination model. In one version of the model, a measurable variable of the model is expressed in terms of a function of a change in depth of shadow (i.e. relative brightness), wherein the depth of shadow depends on the height difference as well as width difference between two features on a semiconductor wafer. In another version of the model, the measurable variable is expressed in terms of a function of a change of a measured distance between two characteristic points on the real image of a periodic structure with respect to a change in a tilt angle of a scanning electron beam.

    MEASURING HEIGHT DIFFERENCE IN PATTERNS ON SEMICONDUCTOR WAFERS

    公开(公告)号:US20200380668A1

    公开(公告)日:2020-12-03

    申请号:US16995077

    申请日:2020-08-17

    IPC分类号: G06T7/00 G06T7/60

    摘要: An improved technique for determining height difference in patterns provided on semiconductor wafers uses real measurements (e.g., measurements from SEM images) and a height difference determination model. In one version of the model, a measurable variable of the model is expressed in terms of a function of a change in depth of shadow (i.e. relative brightness), wherein the depth of shadow depends on the height difference as well as width difference between two features on a semiconductor wafer. In another version of the model, the measurable variable is expressed in terms of a function of a change of a measured distance between two characteristic points on the real image of a periodic structure with respect to a change in a tilt angle of a scanning electron beam.

    Measuring height difference in patterns on semiconductor wafers

    公开(公告)号:US11301983B2

    公开(公告)日:2022-04-12

    申请号:US16995077

    申请日:2020-08-17

    IPC分类号: G06K9/00 G06T7/00 G06T7/60

    摘要: An improved technique for determining height difference in patterns provided on semiconductor wafers uses real measurements (e.g., measurements from SEM images) and a height difference determination model. In one version of the model, a measurable variable of the model is expressed in terms of a function of a change in depth of shadow (i.e. relative brightness), wherein the depth of shadow depends on the height difference as well as width difference between two features on a semiconductor wafer. In another version of the model, the measurable variable is expressed in terms of a function of a change of a measured distance between two characteristic points on the real image of a periodic structure with respect to a change in a tilt angle of a scanning electron beam.