公开(公告)号：US20240101937A1

公开(公告)日：2024-03-28

申请号：US18472688

申请日：2023-09-22

Applicant: Applied Materials, Inc.

Inventor： Wei WU ,  Jhenghan YANG ,  Yongmei CHEN ,  Jinxin FU ,  Ludovic GODET

IPC: C11D7/32 ,  C11D11/00

CPC classification number: C11D7/3281 ,  C11D11/0023 ,  C11D11/0064 ,  C11D11/007

Abstract: Embodiments of the present disclosure herein include a method of removing a contamination material from an optical device. The method may include disposing an optical device in a process chamber, the optical device having optical device structures formed in a substrate, the contamination material is disposed at least on sidewalls of the optical device structures and within trenches between the optical device structures, and exposing the optical device to a plasma generated in the process chamber, the plasma generated from oxygen gas (O2), chlorine gas (Cl2), Argon (Ar), or a combination thereof, the exposing the optical device to the plasma removes the contamination material.

公开(公告)号：US20230253206A1

公开(公告)日：2023-08-10

申请号：US17989557

申请日：2022-11-17

Applicant: Applied Materials, Inc.

Inventor： Yongan XU ,  Wei WU ,  Ludovic GODET

IPC: H01L21/033

CPC classification number: H01L21/0338 ,  H01L21/0335 ,  H01L21/0337

Abstract: Embodiments of the present disclosure generally relate to methods for forming features having small and large line widths on the same substrate or device. In some embodiments, the methods described and discussed herein can be used to produce optical and photonic devices. These devices, including augmented reality (AR) devices and/or virtual reality (VR) devices, have desired pattern areas with different features and/or line widths to achieve the desired optical performance.