公开(公告)号：US20210363627A1

公开(公告)日：2021-11-25

申请号：US16342826

申请日：2018-04-26

Applicant: Applied Materials, Inc.

Inventor： Stefan BANGERT ,  Wolfgang BUSCHBECK ,  Thomas BERGER

IPC: C23C14/04 ,  H01L51/00 ,  H01L51/56 ,  H01L21/67

Abstract: A vacuum processing system for routing a carrier with a substrate is described. The system includes a first vacuum processing chamber for processing the substrate on the carrier; a vacuum buffer chamber providing a processing time delay for the substrate; a second vacuum processing chamber for masked deposition of a material layer on the substrate; and one or more transfer chambers for routing the carrier from the first vacuum chamber to the vacuum buffer chamber and for routing the carrier from the vacuum buffer chamber to the second vacuum chamber.