公开(公告)号：US12198967B2

公开(公告)日：2025-01-14

申请号：US17277152

申请日：2019-07-03

Applicant: Applied Materials, Inc.

Inventor： Kaushik Rao ,  Govinda Raj ,  Anubhav Srivastava ,  Santhosh Kumar Pillappa

IPC: H01L21/683 ,  H01J37/32 ,  H01T23/00

Abstract: The present disclosure generally relates to a substrate support that includes a body having a substrate receiving surface, the body comprising a dielectric material. The body also includes a first foil embedded in the body below the substrate receiving surface. The body also includes an electrically conductive mesh embedded in the body below the first foil. The body also includes a center tap structure formed in a bottom surface of the body that is in electrical communication with the mesh.