公开(公告)号：US20230037719A1

公开(公告)日：2023-02-09

申请号：US17531726

申请日：2021-11-20

Applicant: Applied Materials, Inc.

Inventor： SanKuei Lin ,  Pradeep K. Subrahmanyan

IPC: H01L21/8238 ,  H01L29/66

Abstract: Embodiments of this disclosure relate to methods for removing a dummy material from under a superlattice structure. In some embodiments, after removing the dummy material, it is replaced with a bottom dielectric isolation layer beneath the superlattice structure.

公开(公告)号：US12170230B2

公开(公告)日：2024-12-17

申请号：US17531726

申请日：2021-11-20

Applicant: Applied Materials, Inc.

Inventor： SanKuei Lin ,  Pradeep K. Subrahmanyan

IPC: H01L21/76 ,  H01L21/8238 ,  H01L29/66 ,  H01L21/768 ,  H01L29/15

Abstract: Embodiments of this disclosure relate to methods for removing a dummy material from under a superlattice structure. In some embodiments, after removing the dummy material, it is replaced with a bottom dielectric isolation layer beneath the superlattice structure.