公开(公告)号：US20210183680A1

公开(公告)日：2021-06-17

申请号：US17184454

申请日：2021-02-24

Applicant: Applied Materials, Inc.

Inventor： Hamid NOORBAKHSH ,  Ippei NAKAGAWA ,  Nobuhiro YOSHIDA

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687

Abstract: Implementations described herein provide a substrate support assembly that includes a seal band. The seal band has a ring shaped body. The ring shaped body has an inner surface, a top surface, and a bottom surface. Each of the top surface and the bottom surface extend from the inner surface at a first angle of more than 110° from the inner surface. The seal band also has an outer surface that has an indent formed therein. The outer surface connects the top surface to the bottom surface. A second angle is formed between an imaginary line normal to the inner surface and the bottom surface. The second angle is between about 10° and about 30°. The ring shaped body has a cross-sectional profile forming a V-shape.