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公开(公告)号：US20210402563A1
公开(公告)日：2021-12-30
申请号：US17353193
申请日：2021-06-21
Applicant: Applied Materials, Inc.
Inventor： Periya Gopalan , Allen L. D`Ambra , Kieran J. Rynne
IPC: B24B53/017 , B33Y80/00
Abstract: A conditioner disk for use on a polishing pad during chemical mechanical polishing process includes a backing plate having a lower surface and abrasive diamond particles secured to the lower surface of the backing plate, the abrasive diamond particles disposed in a pattern that defines multiple channels for fluid flow.
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