公开(公告)号：US20140079376A1

公开(公告)日：2014-03-20

申请号：US14088013

申请日：2013-11-22

Applicant: Applied Materials, Inc.

Inventor： Ming-Kuei (Michael) TSENG ,  Norman L. TAM ,  Yoshitaka YOKOTA ,  Agus S. TJANDRA ,  Robert NAVASCA ,  Mehran BEHDJAT ,  Sundar RAMAMURTHY ,  Kedarnath SANGAM ,  Alexander N. LERNER

IPC: H01L21/67 ,  F27D7/06

CPC classification number: H01L21/67115 ,  F27D7/06 ,  H01L21/67017 ,  H01L21/67098

Abstract: Embodiments of the present invention provide apparatus and method for improving gas distribution during thermal processing. One embodiment of the present invention provides an apparatus for processing a substrate comprising a chamber body defining a processing volume, a substrate support disposed in the processing volume, wherein the substrate support is configured to support and rotate the substrate, a gas inlet assembly coupled to an inlet of the chamber body and configured to provide a first gas flow to the processing volume, and an exhaust assembly coupled to an outlet of the chamber body, wherein the gas inlet assembly and the exhaust assembly are disposed on opposite sides of the chamber body, and the exhaust assembly defines an exhaust volume configured to extend the processing volume.

Abstract translation: 本发明的实施例提供了用于改善热处理期间气体分布的装置和方法。 本发明的一个实施例提供了一种用于处理衬底的装置，其包括限定处理体积的室主体，设置在处理容积中的衬底支撑件，其中衬底支撑件构造成支撑和旋转衬底;气体入口组件， 室主体的入口并且被配置为向处理容积提供第一气流，以及联接到室主体的出口的排气组件，其中气体入口组件和排气组件设置在室主体的相对侧上 ，并且排气组件限定了被配置为延长处理量的排气量。