公开(公告)号：US20190355607A1

公开(公告)日：2019-11-21

申请号：US15986452

申请日：2018-05-22

Applicant: Applied Materials, Inc.

Inventor： Shreesha Y. RAO ,  Joseph VINCENT ,  Wenwei QIAO ,  John M. WHITE

IPC: H01L21/683 ,  H01L21/67 ,  H01M2/10

Abstract: Described herein is a substrate carrier comprises a plurality of electrostatic chuck panels and a carrier body. The plurality of electrostatic chuck panels is disposed on the carrier body. The carrier body has an electronics utilities cavity, and a thermal insulating material disposed on at least one wall of the electronics utilities cavity. A battery is disposed within the electronics cavity, and is configured to provide a first power supply signal to control electronics. The carrier body may additionally include a first body member having the electrostatic chuck panels disposed thereon, and a second body member separated from the first body member by thermal breaks. The electronics utilities cavity may be housed within the second body member of the carrier body.