公开(公告)号：US20180323039A1

公开(公告)日：2018-11-08

申请号：US15961282

申请日：2018-04-24

Applicant: Applied Materials, Inc.

Inventor： Hyungje WOO ,  Juan Carlos ROCHA-ALVAREZ ,  Chen-An CHEN ,  Ajit BALAKRISHNA

IPC: H01J37/32 ,  H01L21/683

CPC classification number: H01J37/3299 ,  H01J37/32174 ,  H01J37/32541 ,  H01J2237/3321 ,  H01J2237/3323 ,  H01J2237/3344 ,  H01L21/6833

Abstract: The present disclosure relates to methods and apparatuses for controlling a plasma sheath near a substrate edge. The method includes changing the voltage/current distribution across a central electrode and an annular electrode within the substrate assembly to facilitate the spatial distribution of the plasma across the substrate. The method also includes applying a first radio frequency power to a central electrode embedded in a substrate support and applying a second radio frequency power to an annular electrode embedded in the substrate support at a location different than the central electrode. The annular electrode is spaced from the central electrode and circumferentially surrounds the central electrode. The method also includes monitoring parameters of the first and second radio frequency powers and adjusting one of the first and second radio frequency powers based on the monitored parameters.