公开(公告)号：US20220013386A1

公开(公告)日：2022-01-13

申请号：US16923818

申请日：2020-07-08

Applicant: Applied Materials, Inc.

Inventor： Giridhar KAMESH

IPC: H01L21/67 ,  H01L21/677

Abstract: Embodiments disclosed herein generally include annealing chambers. The annealing chambers allow for high throughput without sacrificing wafer-to-wafer and within wafer uniformity. The annealing chamber includes a transport system, a substrate carrier, and a plurality of thermal sources. The transport system is magnetically coupled to the substrate carrier. The transport system moves the substrate carrier along a path. A substrate supported by the substrate carrier is annealed by the thermal sources. The annealing chamber described herein allows for a higher throughput of substrate (alternatively referred to as a wafer) annealing compared to furnace annealing chambers.

公开(公告)号：US20220157643A1

公开(公告)日：2022-05-19

申请号：US16952979

申请日：2020-11-19

Applicant: Applied Materials, Inc.

Inventor： Giridhar KAMESH ,  Vinodh RAMACHANDRAN ,  Chaitanya A. PRASAD ,  Mohammad AAMIR ,  Daniel C. GLOVER

IPC: H01L21/687 ,  H01L21/02 ,  H01L21/311

Abstract: Embodiments of the present disclosure generally relate to apparatus for substrate processing, and more specifically to apparatus for rotating substrates and to uses thereof. In an embodiment, an apparatus for rotating a substrate is provided. The apparatus includes a levitatable rotor comprising a plurality of magnets embedded therein, a plurality of gas bearings positioned to levitate the levitatable rotor, and a stator magnetically coupled to the levitatable rotor, the stator for producing a rotating magnetic field. Apparatus for processing a substrate with the apparatus for rotating substrates as well as methods of use are also described.