公开(公告)号：US20180337075A1

公开(公告)日：2018-11-22

申请号：US15982785

申请日：2018-05-17

Applicant: Applied Materials, Inc.

Inventor： Dongming IU ,  Kartik SHAH ,  Norman L. TAM ,  Matthew SPULLER ,  Jau-Jiun CHEN ,  Kong Lung Samuel CHAN ,  Elizabeth NEVILLE ,  Preetham RAO ,  Abhilash J. MAYUR ,  Gia Pham

IPC: H01L21/67 ,  C23C16/56 ,  C23C16/458 ,  C23C16/455

Abstract: Embodiments of the disclosure generally relate to a semiconductor processing chamber. In one embodiment, semiconductor processing chamber is disclosed and includes a chamber body having a bottom and a sidewall defining an interior volume, the sidewall having a substrate transfer port formed therein, and one or more absorber bodies positioned in the interior volume in a position opposite of the substrate transfer port.