公开(公告)号：US20150069028A1

公开(公告)日：2015-03-12

申请号：US14533997

申请日：2014-11-05

Applicant: Applied Materials, Inc.

Inventor： Dean JENNINGS ,  Haifan LIANG ,  Mark YAM ,  Vijay PARIHAR ,  Abhilash J. MAYUR ,  Aaron Muir HUNTER ,  Bruce E. ADAMS ,  Joseph Michael RANISH

IPC: B23K26/06 ,  B23K26/00 ,  B23K26/073 ,  H01L21/268 ,  H01L21/324

CPC classification number: B23K26/0608 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/073 ,  B23K26/0732 ,  B23K26/0736 ,  B23K26/0738 ,  B23K26/352 ,  H01L21/02675 ,  H01L21/2026 ,  H01L21/268 ,  H01L21/324

Abstract: A thermal processing apparatus and method in which a first laser source, for example, a CO2 emitting at 10.6 μm is focused onto a silicon wafer as a line beam and a second laser source, for example, a GaAs laser bar emitting at 808 nm is focused onto the wafer as a larger beam surrounding the line beam. The two beams are scanned in synchronism in the direction of the narrow dimension of the line beam to create a narrow heating pulse from the line beam when activated by the larger beam. The energy of GaAs radiation is greater than the silicon bandgap energy and creates free carriers. The energy of the CO2 radiation is less than the silicon bandgap energy so silicon is otherwise transparent to it, but the long wavelength radiation is absorbed by the free carriers.

Abstract translation: 一种热处理装置和方法，其中第一激光源例如以10.6μm发射的CO 2作为线束聚焦在硅晶片上，并且第二激光源例如在808nm处发射的GaAs激光棒是 作为围绕线束的较大波束聚焦在晶片上。 沿着线束的窄尺寸的方向同步地扫描两个光束，以在由较大的光束激活时从线束产生窄的加热脉冲。 GaAs辐射的能量大于硅带隙能量，并产生自由载流子。 CO2辐射的能量小于硅带隙能量，因此硅对其透明度不变，但长波长辐射被自由载流子吸收。

公开(公告)号：US20180099353A1

公开(公告)日：2018-04-12

申请号：US15838010

申请日：2017-12-11

Applicant: Applied Materials, Inc.

Inventor： Dean JENNINGS ,  Haifan LIANG ,  Mark YAM ,  Vijay PARIHAR ,  Abhilash J. MAYUR ,  Aaron Muir HUNTER ,  Bruce E. ADAMS ,  Joseph M. RANISH

IPC: B23K26/06 ,  H01L21/324 ,  H01L21/268 ,  B23K26/073 ,  B23K26/00 ,  H01L21/20

CPC classification number: B23K26/0608 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/073 ,  B23K26/0732 ,  B23K26/0736 ,  B23K26/0738 ,  B23K26/352 ,  H01L21/02675 ,  H01L21/2026 ,  H01L21/268 ,  H01L21/324

Abstract: A thermal processing apparatus and method in which a first laser source, for example, a CO2 emitting at 10.6 μm is focused onto a silicon wafer as a line beam and a second laser source, for example, a GaAs laser bar emitting at 808 nm is focused onto the wafer as a larger beam surrounding the line beam. The two beams are scanned in synchronism in the direction of the narrow dimension of the line beam to create a narrow heating pulse from the line beam when activated by the larger beam. The energy of GaAs radiation is greater than the silicon bandgap energy and creates free carriers. The energy of the CO2 radiation is less than the silicon bandgap energy so silicon is otherwise transparent to it, but the long wavelength radiation is absorbed by the free carriers.

公开(公告)号：US20150053658A1

公开(公告)日：2015-02-26

申请号：US14480415

申请日：2014-09-08

Applicant: Applied Materials, Inc.

Inventor： Bruce E. ADAMS ,  Samuel C. HOWELLS ,  Dean JENNINGS ,  Jiping LI ,  Timothy N. THOMAS ,  Stephen MOFFATT

IPC: B23K26/06 ,  G02B27/09 ,  B23K26/073

CPC classification number: B23K26/073 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/067 ,  B23K26/0732 ,  B23K2103/56 ,  G02B27/0961

Abstract: The present invention generally relates to an optical system that is able to reliably deliver a uniform amount of energy across an anneal region contained on a surface of a substrate. The optical system is adapted to deliver, or project, a uniform amount of energy having a desired two-dimensional shape on a desired region on the surface of the substrate. Typically, the anneal regions may be square or rectangular in shape. Generally, the optical system and methods of the present invention are used to preferentially anneal one or more regions found within the anneal regions by delivering enough energy to cause the one or more regions to re-melt and solidify.

Abstract translation: 本发明一般涉及一种光学系统，其能够在包含在基板的表面上的退火区域上可靠地传递均匀的能量。 光学系统适于在衬底的表面上的期望区域上传送或投影具有期望的二维形状的均匀量的能量。 通常，退火区域可以是正方形或矩形形状。 通常，本发明的光学系统和方法用于通过递送足够的能量以使一个或多个区域再熔化和固化来优先退火在退火区域内发现的一个或多个区域。

公开(公告)号：US20210053147A1

公开(公告)日：2021-02-25

申请号：US17090709

申请日：2020-11-05

Applicant: Applied Materials, Inc.

Inventor： Dean JENNINGS ,  Haifan LIANG ,  Mark YAM ,  Vijay PARIHAR ,  Abhilash J. MAYUR ,  Aaron Muir HUNTER ,  Bruce E. ADAMS ,  Joseph M. RANISH

IPC: B23K26/06 ,  B23K26/352 ,  B23K26/073 ,  H01L21/324 ,  H01L21/268

Abstract: A thermal processing apparatus and method in which a first laser source, for example, a CO2 emitting at 10.6 μm is focused onto a silicon wafer as a line beam and a second laser source, for example, a GaAs laser bar emitting at 808 nm is focused onto the wafer as a larger beam surrounding the line beam. The two beams are scanned in synchronism in the direction of the narrow dimension of the line beam to create a narrow heating pulse from the line beam when activated by the larger beam. The energy of GaAs radiation is greater than the silicon bandgap energy and creates free carriers. The energy of the CO2 radiation is less than the silicon bandgap energy so silicon is otherwise transparent to it, but the long wavelength radiation is absorbed by the free carriers.

公开(公告)号：US20190139773A1

公开(公告)日：2019-05-09

申请号：US16200538

申请日：2018-11-26

Applicant: Applied Materials, Inc.

Inventor： Paul CAREY ,  Aaron Muir HUNTER ,  Dean JENNINGS ,  Abhilash J. MAYUR ,  Stephen MOFFATT ,  William SCHAFFER ,  Timothy N. THOMAS ,  Mark YAM

IPC: H01L21/265 ,  H01L21/268 ,  H01L29/66 ,  H01L29/06 ,  H01L21/324

Abstract: The present invention generally describes one ore more methods that are used to perform an annealing process on desired regions of a substrate. In one embodiment, an amount of energy is delivered to the surface of the substrate to preferentially melt certain desired regions of the substrate to remove unwanted damage created from prior processing steps (e.g., crystal damage from implant processes), more evenly distribute dopants in various regions of the substrate, and/or activate various regions of the substrate. The preferential melting processes will allow more uniform distribution of the dopants in the melted region, due to the increased diffusion rate and solubility of the dopant atoms in the molten region of the substrate. The creation of a melted region thus allows: 1) the dopant atoms to redistribute more uniformly, 2) defects created in prior processing steps to be removed, and 3) regions that have hyper-abrupt dopant concentrations to be formed.

公开(公告)号：US20140009829A1

公开(公告)日：2014-01-09

申请号：US14026681

申请日：2013-09-13

Applicant: Applied Materials, Inc.

Inventor： Dean JENNINGS ,  Timothy N. THOMAS ,  Stephen MOFFATT ,  Jiping LI ,  Bruce E. ADAMS ,  Samuel C. HOWELLS

IPC: G02B27/28 ,  G02B27/10 ,  H01L21/67

CPC classification number: G02B27/283 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/067 ,  G02B27/10 ,  G02B27/144 ,  G02B27/145 ,  G02B27/48 ,  H01L21/268 ,  H01L21/67115

Abstract: A method and apparatus for decorrelating coherent light from a light source, such as a pulsed laser, in both time and space in an effort to provide intense and uniform illumination are provided. For some embodiments employing a pulsed light source, the output pulse may be stretched relative to the input pulse width. The methods and apparatus described herein may be incorporated into any application where intense, uniform illumination is desired, such as pulsed laser annealing, welding, ablating, and wafer stepper illuminating.

Abstract translation: 提供了一种用于在时间和空间上从光源（例如脉冲激光）去除相干光的方法和装置，以提供强烈和均匀的照明。 对于采用脉冲光源的一些实施例，可以相对于输入脉冲宽度拉伸输出脉冲。 本文描述的方法和装置可以结合到需要强烈均匀照明的任何应用中，例如脉冲激光退火，焊接，烧蚀和晶片步进照明。