公开(公告)号：US20210035795A1

公开(公告)日：2021-02-04

申请号：US16936918

申请日：2020-07-23

Applicant: APPLIED MATERIALS, INC.

Inventor： Qi Jie PENG ,  Prayudi LIANTO ,  Chin Wei TAN ,  Sriskantharajah THIRUNAVUKARASU ,  Arvind SUNDARRAJAN ,  Jun-Liang SU ,  Fang Jie LIM ,  Manorajh ARUNAKIRI ,  Wei Jie Dickson TEO ,  Karrthik PARATHITHASAN ,  Puay Han TAN

IPC: H01L21/02 ,  H01L21/683 ,  H01L21/324

Abstract: Methods and apparatus for reducing warpage of a substrate. In some embodiments, a method of reducing substrate warpage comprises heating the substrate with an epoxy layer to at least a glass transition temperature of the epoxy layer while allowing the substrate to expand; maintaining the at least the glass transition temperature of the substrate until the substrate is constrained; constraining the substrate with a total clamping force of approximately 5000N to approximately 7000N exerted towards the substrate from a top direction and a bottom direction; applying at least one electrostatic field to the substrate with a first electrostatic chuck positioned above the substrate and a second electrostatic chuck positioned below the substrate; and rapidly cooling the substrate using a first liquid convection heat sink positioned above the substrate and a second liquid convection heat sink positioned below the substrate.

公开(公告)号：US20230061379A1

公开(公告)日：2023-03-02

申请号：US17410958

申请日：2021-08-24

Applicant: Applied Materials, Inc.

Inventor： Fang Jie LIM ,  Chin Wei TAN ,  Jun-Liang SU ,  Felix DENG ,  Sai Kumar KODUMURI ,  Ananthkrishna JUPUDI ,  Nuno Yen-Chu CHEN

IPC: H01L21/56 ,  H01L23/00 ,  H01L21/67

Abstract: Embodiments of methods and apparatus for reducing warpage of a substrate are provided herein. In some embodiments, a method for reducing warpage of a substrate includes: applying an epoxy mold over a plurality of dies on the substrate in a dispenser tool; placing the substrate on a pedestal in a curing chamber, wherein the substrate has an expected post-cure deflection in a first direction; inducing a curvature on the substrate in a direction opposite the first direction; and curing the substrate by heating the substrate in the curing chamber.

公开(公告)号：US20230009864A1

公开(公告)日：2023-01-12

申请号：US17369519

申请日：2021-07-07

Applicant: Applied Materials, Inc.

Inventor： Jun-Liang SU ,  Chin Wei TAN ,  Fang Jie LIM

IPC: H01L21/66 ,  G01B9/02

Abstract: Methods and apparatus for processing a substrate are provided. For example, metrology apparatus configured for use with a substrate processing platform comprise an interferometer configured to obtain a first set of measurements at a first set of points along a surface of a substrate, a sensor configured to obtain a second set of measurements at a second set of points different from the first set of points along the surface of the substrate, an actuator configured to position the interferometer and the sensor at various positions along a measurement plane parallel to the surface of the substrate for obtaining the first set of measurements and the second set of measurements, and a substrate support comprising a substrate support surface for supporting the substrate beneath the measurement plane while obtaining the first set of measurements and the second set of measurements.

公开(公告)号：US20220085268A1

公开(公告)日：2022-03-17

申请号：US17023999

申请日：2020-09-17

Applicant: APPLIED MATERIALS, INC.

Inventor： Sriskantharajah THIRUNAVUKARASU ,  Puay Han TAN ,  Karrthik PARATHITHASAN ,  Jun-Liang SU ,  Fang Jie LIM ,  Chin Wei TAN ,  Wei Jie Dickson TEO

IPC: H01L35/32 ,  H05K1/02 ,  H01L23/00

Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a system for processing a substrate includes a process chamber comprising a first processing volume and a second processing volume, a carrier disposed in the first processing volume, comprising a first thermoelectric module (TEM), and configured to support the substrate while the substrate is being heated or cooled, a chuck disposed within the second processing volume, comprising a second TEM, and configured to receive the substrate from the carrier and to support the substrate while the substrate is being heated or cooled, and a system controller configured to monitor a temperature of at least one of the substrate, the carrier, or the chuck during operation, and based on the temperature of the at least one of the substrate, the carrier, or the chuck, supply current to at least one of the first TEM or the second TEM.