公开(公告)号：US20250114908A1

公开(公告)日：2025-04-10

申请号：US18483070

申请日：2023-10-09

Applicant: Applied Materials, Inc.

Inventor： Nai-Chieh Huang ,  Akshay Aravindan ,  Shih-Haur Shen ,  Jianshe Tang ,  Jay Gurusamy ,  Chen-Wei Chang ,  Chih-Han Yang ,  Wei Lu

IPC: B24B53/017

Abstract: A system may include a gimbal defining a plurality of pockets, where each pocket may include a first portion and a second portion that extends between the first portion and a base of the pocket. The second portion may have a greater diameter than the first portion. The system may include a plurality of conditioning disks, where each conditioning disk is seated within the first portion of a respective pocket. The system may include a plurality of gaskets, where each gasket is seated within the second portion of a respective pocket. The system may include a plurality o-rings, each o-ring disposed between a peripheral edge of one of the plurality of conditioning disks and a lateral wall of one of the plurality of pockets. The system may include a plurality of shoulder screws for coupling the gimbal with one of the plurality of gaskets and a conditioning disk.

公开(公告)号：US20250114909A1

公开(公告)日：2025-04-10

申请号：US18481761

申请日：2023-10-05

Applicant: Applied Materials, Inc.

Inventor： Priscilla Diep LaRosa ,  Chih Chung Chou ,  Haosheng Wu ,  Taketo Sekine ,  Chen-Wei Chang ,  Elton Zhong ,  Jianshe Tang ,  Songling Shin

IPC: B24B55/03 ,  B24B37/015 ,  B24B37/20

Abstract: A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a polishing liquid dispenser having a polishing liquid port positioned over the platen to deliver polishing liquid onto the polishing pad, a temperature control system including coolant liquid fluid reservoirs for containing coolant fluids, a thermal controller configured to control the temperature of the coolant fluid within the coolant fluid reservoirs, and a first dispenser having openings in fluid connection with the coolant fluid reservoirs, the openings positioned configured to spray an aerosolized coolant liquid directly onto the polishing pad, and a second dispenser having a coolant port in fluid connection with the coolant fluid reservoirs, the coolant port positioned over the platen and configured to flow a stream of coolant liquid directly onto the polishing pad.

公开(公告)号：US20250114903A1

公开(公告)日：2025-04-10

申请号：US18483973

申请日：2023-10-10

Applicant: Applied Materials, Inc.

Inventor： Chen-Wei Chang ,  Priscilla Diep ,  Jimin Zhang ,  Taketo Sekine ,  Jianshe Tang ,  Haosheng Wu

IPC: B24B37/30 ,  B24B37/04

Abstract: Exemplary carrier heads for a chemical mechanical polishing apparatus may include a carrier body. The carrier heads may include a flexible membrane coupled with the carrier body. The flexible membrane may include a substrate-receiving surface that faces away from the carrier body. The substrate-receiving surface may include a plurality of gripping elements that protrude away from the substrate-receiving surface. Each of the plurality of gripping elements may have a maximum lateral dimension that is no greater than 2 mm.