公开(公告)号：US20240234204A9

公开(公告)日：2024-07-11

申请号：US17970872

申请日：2022-10-21

Applicant: Applied Materials, Inc.

Inventor： Zhaoxuan WANG ,  Jianxin LEI ,  Wenting HOU ,  Sung-Kwan KANG ,  Anand Nilakantan IYER

IPC: H01L21/768 ,  H01L23/532

CPC classification number: H01L21/76841 ,  H01L21/76829 ,  H01L23/53266

Abstract: A method to produce a layered substrate, which includes the steps of depositing a diffusion barrier layer on the substrate; depositing an underlayer comprising a Group 6 metal on the barrier layer; and depositing a ruthenium layer comprising ruthenium on the underlayer, to produce the layered substrate. A layered substrate is also disclosed.

公开(公告)号：US20240042571A1

公开(公告)日：2024-02-08

申请号：US18381223

申请日：2023-10-18

Applicant: Applied Materials, Inc.

Inventor： Chih Chung CHOU ,  Anand Nilakantan IYER ,  Ekaterina A. MIKHAYLICHENKO ,  Christopher Heung-Gyun LEE ,  Erik RONDUM ,  Tiffany Yu-nung CHEUNG ,  Shou-Sung CHANG

IPC: B24B37/04 ,  H01L21/306

CPC classification number: B24B37/042 ,  H01L21/30625

Abstract: Methods and apparatuses for dispensing polishing fluids onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP apparatus for processing a substrate including a pad disposed on a platen. The pad has a pad radius and a central axis from which the pad radius extends. The apparatus also include a carrier assembly configured to be disposed on a surface of the pad and having a carrier radius that extends from a rotational axis of the carrier assembly and a fluid delivery assembly comprising one or more nozzles, each nozzle coupled to a fast actuating valve.

公开(公告)号：US20240136223A1

公开(公告)日：2024-04-25

申请号：US17970872

申请日：2022-10-20

Applicant: Applied Materials, Inc.

Inventor： Zhaoxuan WANG ,  Jianxin LEI ,  Wenting HOU ,  Sung-Kwan KANG ,  Anand Nilakantan IYER

IPC: H01L21/768 ,  H01L23/532

CPC classification number: H01L21/76841 ,  H01L21/76829 ,  H01L23/53266

Abstract: A method to produce a layered substrate, which includes the steps of depositing a diffusion barrier layer on the substrate; depositing an underlayer comprising a Group 6 metal on the barrier layer; and depositing a ruthenium layer comprising ruthenium on the underlayer, to produce the layered substrate. A layered substrate is also disclosed.

公开(公告)号：US20220097206A1

公开(公告)日：2022-03-31

申请号：US17035504

申请日：2020-09-28

Applicant: Applied Materials, Inc.

Inventor： Christopher Heung-Gyun LEE ,  Anand Nilakantan IYER ,  Hyuen Karen TRAN ,  Ghunbong CHEUNG

IPC: B24B53/00 ,  B24B29/04

Abstract: Embodiments herein generally relate to chemical mechanical polishing (CMP) systems and methods for reducing non-uniform material removal rate at or near the peripheral edge of a substrate when compared to radially inward regions therefrom. In one embodiment, a polishing system includes a substrate carrier comprising an annular retaining ring which is used to surround a to-be-processed substrate during a polishing process and a polishing platen. The polishing platen includes cylindrical metal body having a pad-mounting surface. The pad-mounting surface comprises a plurality of polishing zones which include a first zone having a circular or annular shape, a second zone circumscribing the first zone, and a third zone circumscribing the second zone. A surface of the second zone is recessed from surfaces of the first and third zones adjacent thereto, and a width of the second zone is less than an outer diameter of the annular retaining ring.