公开(公告)号：US20250043423A1

公开(公告)日：2025-02-06

申请号：US18228549

申请日：2023-07-31

Applicant: Applied Materials, Inc.

Inventor： William Durand ,  Abdullah Zafar ,  Usman Chowdhury ,  Amir Bayati ,  Farzad Houshmand ,  David J. Coumou ,  Kasturi Sarang ,  Kenric Choi

IPC: C23C16/455 ,  G01N21/3504

Abstract: Vapor concentration sensors for deposition process or deposition chamber condition monitoring are described. In an example, a deposition system includes a deposition chamber, a deposition precursor source coupled to an inlet of the deposition chamber, and a non-dispersive infrared (NDIR) vapor concentration sensor between the deposition precursor source and the deposition chamber.

公开(公告)号：US20230411130A1

公开(公告)日：2023-12-21

申请号：US17841557

申请日：2022-06-15

Applicant: Applied Materials, Inc.

Inventor： Abdullah Zafar ,  Kelvin Chan ,  Philip Allan Kraus

IPC: H01J37/32 ,  G01N21/35

CPC classification number: H01J37/3299 ,  H01J37/32357 ,  G01N21/27 ,  H01J2237/24585 ,  G01N21/35

Abstract: Embodiments disclosed herein include semiconductor processing tools. In an embodiment, the semiconductor processing tool comprises a plasma source, and a chamber coupled to the plasma source. In an embodiment, a pump is coupled to the chamber. In an embodiment, the semiconductor processing tool further comprises a sampling line. In an embodiment, the sampling line comprises a reaction chamber, and an absorption chamber.

公开(公告)号：US20230411129A1

公开(公告)日：2023-12-21

申请号：US17841561

申请日：2022-06-15

Applicant: Applied Materials, Inc.

Inventor： Abdullah Zafar ,  Kelvin Chan ,  Philip Allan Kraus

IPC: H01J37/32 ,  G01N21/27 ,  H01L21/67

CPC classification number: H01J37/32972 ,  H01J37/32357 ,  G01N21/27 ,  H01L21/67253 ,  H01J2237/2482

Abstract: Embodiments disclosed herein include a semiconductor processing tool. In an embodiment, the semiconductor processing tool comprises a chamber, a pedestal in the chamber configured to secure a substrate, and a plasma source above the pedestal. In an embodiment, a laser source is coupled to the chamber, and a detector is coupled to the chamber across from the laser source. In an embodiment, the detector is configured to be optically coupled to the laser source.