ANODIZED ALUMINUM ALLOYS HAVING ALLOYING ELEMENTS TO ELIMINATE FILIFORM CORROSION

    公开(公告)号:US20190037721A1

    公开(公告)日:2019-01-31

    申请号:US15662056

    申请日:2017-07-27

    Applicant: Apple Inc.

    Abstract: Anodized aluminum alloys that are resistant to corrosion are described. According to some embodiments, the anodized aluminum alloys include very small amounts, even trace levels, of corrosion resistant elements with higher Gibbs free energies for oxide formation than aluminum. If the aluminum alloy includes high levels of zinc, the corrosion resistant elements can also have higher Gibbs free energies for oxide formation than zinc. The corrosion resistant elements can accumulate at an interface region of the substrate near the anodic film during the anodizing process, thereby significantly changing the alloy composition in this interface region providing surprising high resistance to certain forms of corrosion. The type and amount of corrosion resistant elements can depend on particular application requirements. In some cases, the anodized aluminum alloys are used as cosmetic appealing housing for consumer electronic products.

    CLADDED METAL STRUCTURES FOR DISSIPATION OF HEAT IN A PORTABLE ELECTRONIC DEVICE

    公开(公告)号:US20190380224A1

    公开(公告)日:2019-12-12

    申请号:US16407011

    申请日:2019-05-08

    Applicant: Apple Inc.

    Abstract: This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.

    THERMALLY CONDUCTIVE STRUCTURE FOR DISSIPATING HEAT IN A PORTABLE ELECTRONIC DEVICE

    公开(公告)号:US20190082555A1

    公开(公告)日:2019-03-14

    申请号:US16127043

    申请日:2018-09-10

    Applicant: Apple Inc.

    Abstract: This application relates to a portable electronic device. The portable electronic device includes an operational component capable of generating heat and walls that define a cavity capable of carrying the operational component. The portable electronic device further includes a support plate that is welded to at least one of the walls. The support plate includes a thermally conductive layer that is thermally coupled to the operational component, where the thermally conductive layer includes a first material that is capable of conducting at least some of the heat away from the electronic component. The support plate further includes a first stiffness promoting layer that is welded to the thermally conductive layer, where the first stiffness promoting layer includes a second material having sufficient material hardness for welding the support plate to at least one of the walls such as to increase a stiffness of the support plate.

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