公开(公告)号：US12010416B1

公开(公告)日：2024-06-11

申请号：US17024024

申请日：2020-09-17

Applicant: Apple Inc.

Inventor： Wei Shi ,  Adar Magen

IPC: H04N23/57 ,  H01L27/146 ,  H04N23/54 ,  H04N23/55 ,  H04N23/60

CPC classification number: H04N23/57 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14683 ,  H04N23/54 ,  H04N23/60 ,  H04N23/55

Abstract: An embedded ceramic substrate package includes a ceramic substrate embedded in one or more layers. The one or more layers include at least a bulk molding compound (BMC) and a redistribution layer (RDL). At least a portion of the one or more layers includes electrical signal trace routing. The embedded ceramic substrate package is attached to an image sensor that is configured to capture light projected onto a surface of the image sensor.