公开(公告)号：US20250046674A1

公开(公告)日：2025-02-06

申请号：US18365062

申请日：2023-08-03

Applicant: Apple Inc.

Inventor： Suk-Kyu Ryu ,  Wei Hu ,  Jie-Hua Zhao ,  Myung Jin Yim

IPC: H01L23/42 ,  H01L23/00 ,  H01L23/367

Abstract: A module comprising: a module substrate; a system-on-chip die coupled to the module substrate; a thermal interface material layer coupled to the system-on-chip die; a stiffener structure positioned around the system-on-chip die and coupled to the module substrate; and a lid having a first portion coupled to the thermal interface material layer, a second portion coupled to the stiffener structure and a recessed region formed around the first portion and having a reduced thickness relative to the first portion and the second portion.