公开(公告)号：US20240385669A1

公开(公告)日：2024-11-21

申请号：US18351858

申请日：2023-07-13

Applicant: Apple Inc.

Inventor： Vijayanish Varadharajan ,  Madhavi V. Tagare ,  Mao Ye ,  Jikang Chen ,  Gregory G. Hurley ,  Yezhou Wu ,  Andrew James Lambert

IPC: G06F1/30 ,  G06F1/26 ,  G06F1/28

Abstract: An electronic device can include a plurality of subsystems; a primary power source; at least one backup energy storage; and a shutdown controller that detects unavailability of the primary power source. Upon detecting unavailability of the primary power source, the shutdown controller can cause one or more of the plurality of subsystems to reduce their power consumption; engage the at least one backup energy storage; initiate immediate power down of a first subset of the plurality of subsystems that does not result in data loss, data corruption, or physical system damage; and initiate sequenced power down of a second subset of the plurality of subsystems to prevent data loss or system damage, the second subset of the plurality of subsystems being powered by the at least one backup energy storage during the sequenced power down.

公开(公告)号：US11709365B1

公开(公告)日：2023-07-25

申请号：US17228592

申请日：2021-04-12

Applicant: Apple Inc.

Inventor： Muhammad F. Hossain ,  Jia Tao ,  Vijayanish Varadharajan ,  Alexander M. Brukwinski ,  Pyone P. Wynn ,  Hnin Ookhin ,  Samuel A. Resnick ,  Aviran Malik ,  Jason C. Sauers ,  Amarnath Vuppala

IPC: G02B27/01 ,  H02P29/66

CPC classification number: G02B27/0176 ,  H02P29/664 ,  G02B2027/0138 ,  G02B2027/0192

Abstract: A head-mountable device can effectively manage heat with a motor assembly that efficiently and accurately senses a temperature of a motor. A temperature sensor can be provided on an outer surface (e.g., case) of the motor. A flex circuit can be operably connect both the motor and the temperature sensor to a controller of the head-mountable device. The flex circuit can have a first side coupled to the outer surface of the case, a second side supporting the temperature sensor, and thermally conductive vias extending from the first side to the second side to conduct heat from the case to the sensor. The flex circuit can further include a memory comprising calibration data of the temperature sensor and a connector for outputting temperature data based on the temperature sensor and the calibration data of the memory.