公开(公告)号：US20190028791A1

公开(公告)日：2019-01-24

申请号：US16139890

申请日：2018-09-24

Applicant: Apple Inc.

Inventor： John Bruss ,  Robert A. Boyd ,  Carlos M. Santana ,  Vijay Koneru

IPC: H04R1/10 ,  H01R12/53 ,  H01R12/57 ,  H01R43/20 ,  H05K5/00 ,  H01H13/50

Abstract: Earphone assemblies with multiple subassembly housings are provided.

公开(公告)号：US20180070164A1

公开(公告)日：2018-03-08

申请号：US15696525

申请日：2017-09-06

Applicant: Apple Inc.

Inventor： John Bruss ,  Robert A. Boyd ,  Carlos M. Santana ,  Vijay Koneru

IPC: H04R1/10 ,  H01R12/53 ,  H01R12/57 ,  H01R43/20 ,  H05K5/00 ,  H01H13/50

CPC classification number: H04R1/1016 ,  H01H13/50 ,  H01R12/53 ,  H01R12/57 ,  H01R43/205 ,  H04R1/1033 ,  H04R1/1041 ,  H04R1/1066 ,  H04R2201/103 ,  H04R2201/105 ,  H04R2201/107 ,  H04R2420/03 ,  H04R2420/07 ,  H04R2460/07 ,  H05K5/0017

Abstract: Earphone assemblies with multiple subassembly housings are provided.

公开(公告)号：US10085080B2

公开(公告)日：2018-09-25

申请号：US15696525

申请日：2017-09-06

Applicant: Apple Inc.

Inventor： John Bruss ,  Robert A. Boyd ,  Carlos M. Santana ,  Vijay Koneru

IPC: H04R1/10 ,  H01R12/57 ,  H01R12/53 ,  H01R43/20 ,  H05K5/00 ,  H01H13/50

CPC classification number: H04R1/1016 ,  H01H9/0228 ,  H01H13/50 ,  H01H2217/004 ,  H01H2217/024 ,  H01R12/53 ,  H01R12/57 ,  H01R43/205 ,  H04R1/1033 ,  H04R1/1041 ,  H04R1/1066 ,  H04R2201/103 ,  H04R2201/105 ,  H04R2201/107 ,  H04R2420/03 ,  H04R2420/07 ,  H04R2460/07 ,  H05K5/0017

Abstract: Earphone assemblies with multiple subassembly housings are provided.