公开(公告)号：US20240106137A1

公开(公告)日：2024-03-28

申请号：US17951699

申请日：2022-09-23

Applicant: Apple Inc.

Inventor： James M. Jeon ,  Mahmoud R. Amini ,  Marc Soriano Baliarda ,  Tianrun Jiang

IPC: H01R12/52 ,  H01R13/533

CPC classification number: H01R12/523 ,  H01R13/533

Abstract: Connector receptacles that can provide a robust and reliable connection to a board and have a small form factor. An example can provide connector receptacles that provide a robust and reliable connection to a board by providing contacts having highly planarized solder tails. The solder tails can be supported by extensions of housing portions to provide consistent placement and alignment, as well an amount of shock absorption. The solder tails can include chamfered surfaces to improve soldered connections to pads of a board. The chamfered surfaces can also enable a reduced pitch between solder tails thereby helping to provide a reduced form factor.