公开(公告)号：US20190382911A1

公开(公告)日：2019-12-19

申请号：US16360851

申请日：2019-03-21

Applicant: Apple Inc.

Inventor： James A. CURRAN ,  Rohit G. PURANIK ,  Shi Hua ZHANG ,  James A. DEAN ,  Karin H. RASMUSSEN

IPC: C25D11/24 ,  C25D11/14 ,  C25D11/34

Abstract: This application relates to an enclosure for a portable electronic device. The enclosure includes an aluminum alloy substrate and an anodized layer overlaying and formed from the aluminum alloy substrate, wherein the anodized layer has an external surface that has a concentration of zinc that is between about 3 wt % to about 7 wt %.

公开(公告)号：US20190098785A1

公开(公告)日：2019-03-28

申请号：US16125409

申请日：2018-09-07

Applicant: Apple Inc.

Inventor： Todd S. MINTZ ,  Shi Hua ZHANG ,  Abhijeet MISRA ,  Eric W. HAMANN

IPC: H05K5/06 ,  H05K5/00 ,  H05K5/04 ,  C23F1/02

Abstract: This application relates to a composite part that can include a non-metal layer having attachment features, and a metal part that is joined with the non-metal layer. The metal part can include a plurality of interlocking structures that are disposed at an external surface of the metal part, where each of the interlocking structures can include an opening characterized as having a first width, and an undercut region, where the opening leads into the undercut region, and the undercut region is characterized as having a second width that is greater than the first width such that the undercut region captures and retains one of the attachment features of the non-metal layer.