公开(公告)号：US20190104645A1

公开(公告)日：2019-04-04

申请号：US16027152

申请日：2018-07-03

Applicant: Apple Inc.

Inventor： Sabrina K. PASEMAN ,  Timothy P. M. JOHNSON

IPC: H05K7/20 ,  A45C11/00 ,  G06F1/20

Abstract: Aspects of the subject technology relate to electronic devices having adaptive surfaces. An adaptive surface may expand or deform responsive to a temperature change and/or a mechanical strain for thermal management for the device or for mechanical restructuring of the device in various configurations. The adaptive surface may be formed from a negative Poisson's ratio relief pattern in the surface or an inhomogeneous arrangement of materials.

公开(公告)号：US20160277819A1

公开(公告)日：2016-09-22

申请号：US15072312

申请日：2016-03-16

Applicant: Apple Inc.

Inventor： Michael D. McBROOM ,  Bartley K. ANDRE ,  Mikael M. SILVANTO ,  Matthew A. DONARSKI ,  Alexander V. SALVATTI ,  Daniel K. BOOTHE ,  Ryan J. MIHELICH ,  Sabrina K. PASEMAN

IPC: H04R1/02 ,  H04R1/28 ,  H04R9/06

CPC classification number: H04R9/06 ,  G06F1/16 ,  G06F1/20 ,  H04R1/02 ,  H04R1/34 ,  H04R9/02 ,  H04R2201/029 ,  H04R2209/022 ,  H04R2400/11 ,  H04R2499/15

Abstract: An electronic device including a frame member suitable for use with an audio driver is disclosed. The frame member may include a recessed region that receives the audio driver. The frame member may further include a flange member surrounding the recessed region. The frame member may be formed from a material having a relatively high coefficient of thermal conductivity. Accordingly, the frame member can dissipate thermal energy (heat) generated from the audio driver. In addition, the frame member may be seated in an enclosure of an electronic device in a manner that allows the frame member to pass the thermal energy to the enclosure. Also, the frame member may include a ferromagnetic material, which may cause the frame member to direct magnetic flux from a magnet of the audio driver in a desired manner.

Abstract translation: 公开了一种包括适合与音频驱动器一起使用的框架部件的电子设备。 框架构件可以包括接收音频驱动器的凹陷区域。 框架构件还可以包括围绕凹陷区域的凸缘构件。 框架构件可以由具有相对高的导热系数的材料形成。 因此，框架构件可以消散从音频驱动器产生的热能（热）。 此外，框架构件可以以允许框架构件将热能传递到外壳的方式坐在电子设备的外壳中。 此外，框架构件可以包括铁磁材料，其可以使框架构件以期望的方式引导来自音频驱动器的磁体的磁通量。