公开(公告)号：US20160147269A1

公开(公告)日：2016-05-26

申请号：US15012661

申请日：2016-02-01

Applicant: Apple Inc.

Inventor： Brett W. DEGNER ,  William F. LEGGETT ,  Jay S. NIGEN ,  Frank F. LIANG ,  Richard H. TAN

IPC: G06F1/20 ,  F28D15/04

CPC classification number: G06F1/203 ,  B23P15/26 ,  F28D1/024 ,  F28D15/02 ,  F28D15/0233 ,  F28D15/0275 ,  F28D15/04 ,  H05K5/02 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20336 ,  Y10T29/49826

Abstract: The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.

公开(公告)号：US20160307819A1

公开(公告)日：2016-10-20

申请号：US15191404

申请日：2016-06-23

Applicant: Apple Inc.

Inventor： Jay S. NIGEN ,  Ron A. HOPKINSON ,  Derek J. YAP ,  Eric A. KNOPF ,  William F. LEGGETT ,  Richard H. TAN

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/552

CPC classification number: H01L23/3735 ,  F28F21/00 ,  G06F1/20 ,  H01L21/4882 ,  H01L23/3737 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K1/141 ,  H05K3/0061 ,  H05K7/20436 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/10159 ,  H01L2924/00

Abstract: The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.

公开(公告)号：US20160357231A1

公开(公告)日：2016-12-08

申请号：US15242379

申请日：2016-08-19

Applicant: Apple Inc.

Inventor： Brett W. DEGNER ,  William F. LEGGETT ,  Jay S. NIGEN ,  Frank F. LIANG ,  Richard H. TAN

IPC: G06F1/20 ,  H05K7/20 ,  F28D15/04

CPC classification number: G06F1/203 ,  B23P15/26 ,  F28D1/024 ,  F28D15/02 ,  F28D15/0233 ,  F28D15/0275 ,  F28D15/04 ,  H05K5/02 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20336 ,  Y10T29/49826

Abstract: The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.