公开(公告)号：US20200024492A1

公开(公告)日：2020-01-23

申请号：US16194153

申请日：2018-11-16

Applicant: Apple Inc.

Inventor： John C. DIFONZO ,  Tyler J. EWING ,  Nathan MORRIS ,  David S. HERMAN

IPC: C09J9/00 ,  C09J11/04 ,  C09J5/06 ,  H05K5/00 ,  H05K1/18 ,  H05K3/30

Abstract: This application relates to an assembly technique for joining parts using a magnetic adhesive. A liquid adhesive including magnetic particles is provided, the liquid adhesive having sufficient properties that allow the adhesive to flow under the influence of a magnetic field prior to curing. A method for joining parts includes the steps of applying an adhesive to a substrate at a location corresponding to the joint, placing a magnetic element proximate the joint to generate a magnetic field that interacts with the magnetic particles in the adhesive to cause the adhesive to flow in a direction corresponding to the magnetic field, and curing the magnetic adhesive under the influence of the magnetic field. An assembly fixture for joining parts includes a magnetic element and, optionally, an inductive heating element. The assembly technique can be used to form a housing of an electronic device from two or more components.