公开(公告)号：US20200379034A1

公开(公告)日：2020-12-03

申请号：US16562350

申请日：2019-09-05

Applicant: Apple Inc.

Inventor： Jay Mayur KHANDHAR ,  Karen ECKERT ,  Cyril DE LA CROPTE DE CHANTERAC ,  John ANANNY

IPC: G01R31/28 ,  G01R31/3183 ,  G06F17/50

Abstract: Thermal conditions can be simulated for an electronic device. Application developers may want to test how applications perform under various thermal conditions on a device that includes thermal management. The application developers can use the tests to determine whether the application should take proactive measures to maintain application performance, and which proactive measures should be taken. For example, an application can reduce its use of resources to ensure that an application maintains a desired quality of user experience (and at a minimum remains responsive) under adverse thermal conditions. Creating adverse conditions can be difficult to replicate, costly to implement, and can potential cause damage to the electronic device being tested. In some examples, simulating thermal conditions can be used instead of placing the device in real-world adverse conditions to improve the testing process for developers.